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19-3693; Rev 2; 1/07
Ultra-Small, Overvoltage Protection/ Detection Circuits
General Description
The MAX16010-MAX16014 is a family of ultra-small, lowpower, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automotive, telecom, and industrial applications. These devices operate over a wide 5.5V to 72V supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. The MAX16010 and MAX16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. These comparators offer opendrain outputs capable of handling voltages up to 72V. The MAX16010 features complementary enable inputs (EN/EN), while the MAX16011 features an active-high enable input and a selectable active-high/low OUTB output. The MAX16012 offers a single comparator and an independent reference output. The reference output can be directly connected to either the inverting or noninverting input to select the comparator output logic. The MAX16013 and MAX16014 are overvoltage protection circuits that are capable of driving two p-channel MOSFETs to prevent reverse-battery and overvoltage conditions. One MOSFET (P1) eliminates the need for external diodes, thus minimizing the input voltage drop. The second MOSFET (P2) isolates the load or regulates the output voltage during an overvoltage condition. The MAX16014 keeps the MOSFET (P2) latched off until the input power is cycled. The MAX16010 and MAX16011 are available in small 8-pin TDFN packages, while the MAX16012/MAX16013/ MAX16014 are available in small 6-pin TDFN packages. These devices are fully specified from -40C to +125C. Open-Drain Outputs Up to 72V (MAX16010/MAX16011/MAX16012) Fast 2s (max) Propagation Delay Internal Undervoltage Lockout p-Channel MOSFET Latches Off After an Overvoltage Condition (MAX16014) Adjustable Overvoltage Threshold -40C to +125C Operating Temperature Range Small 3mm x 3mm TDFN Package
Features
Wide 5.5V to 72V Supply Voltage Range
MAX16010-MAX16014
Ordering Information
PART* MAX16010TA_-T MAX16011TA_-T MAX16012TT-T MAX16013TT-T MAX16014TT-T TEMP RANGE -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C PINPACKAGE 8 TDFN-EP** 8 TDFN-EP** 6 TDFN-EP** 6 TDFN-EP** 6 TDFN-EP** PKG CODES T833-2 T833-2 T633-2 T633-2 T633-2
Note: Replace the "_" with "A" for 0.5% hysteresis, "B" for 5% hysteresis, and "C" for 7.5% hysteresis. *Replace -T with +T for lead-free packages. **EP = Exposed pad.
Typical Operating Circuit
P1 P2
Applications
Automotive Industrial 48V Telecom/Server/Networking FireWire(R) Notebook Computers Multicell Battery-Stack Powered Equipment
R1 2M* VBATT
GATE1
VCC
GATE2
FireWire is a registered trademark of Apple Computer, Inc.
R2
SET
MAX16013 MAX16014
GND
Pin Configurations appear at end of data sheet.
*OPTIONAL
________________________________________________________________ Maxim Integrated Products
1
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
ABSOLUTE MAXIMUM RATINGS
(All pins referenced to GND, unless otherwise noted.) VCC .........................................................................-0.3V to +80V EN, EN, LOGIC...........................................-0.3V to (VCC + 0.3V) INA+, INB-, IN+, IN-, REF, SET ..............................-0.3V to +12V OUTA, OUTB, OUT.................................................-0.3V to +80V GATE1, GATE2 to VCC ...........................................-12V to +0.3V GATE1, GATE2...........................................-0.3V to (VCC + 0.3V) Current Sink/Source (all pins) .............................................50mA Continuous Power Dissipation (TA = +70C) 6-Pin TDFN (derate 18.2mW/C above +70C) .........1455mW 8-Pin TDFN (derate 18.2mW/C above +70C) .........1455mW Operating Temperature Range .........................-40C to +125C Maximum Junction Temperature .....................................+150C Storage Temperature Range .............................-60C to +150C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = 14V, TA = -40C to +125C, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Supply Voltage Range Input Supply Current SYMBOL VCC ICC No load VCC = 12V VCC = 48V CONDITIONS MIN 5.5 20 25 TYP MAX 72.0 30 40 UNITS V A
VCC Undervoltage Lockout
VUVLO
VCC rising, part enabled, VINA+ = 2V, OUTA deasserted (MAX16010/MAX16011), VIN = 2V, VOUT deasserted (MAX16012), VSET = 0V, GATE2 = VCLMP (MAX16013/ MAX16014) 0.5% hysteresis, MAX16010/MAX16011
4.75
5
5.25
V
VTH+ INA+/INB-/SET Threshold Voltage 5.0% hysteresis, MAX16010/MAX16011/ MAX16013/MAX16014 7.5% hysteresis MAX16010/MAX16011 MAX16010TAA/MAX16011TAA Threshold-Voltage Hysteresis MAX16010TAB/MAX16011TAB/ MAX16013/MAX16014 MAX16010TAC/MAX16011TAC SET/IN_ Input Current IN_ Operating Voltage Range Startup Response Time IN_ to OUT/SET to GATE2 Propagation Delay OUT_ Output-Voltage Low OUT_ Leakage Current tSTART tPROP VCC rising from 0 to 5.5V IN_/SET rising from (VTH - 100mV) to (VTH + 100mV) or falling from (VTH + 100mV) to (VTH - 100mV) (no load) VCC 5.5V, ISINK = 3.2mA VCC 2.8V, ISINK = 100A OUT_ = 72V SET/IN_ = 2V
1.215 1.21 1.15 1.12
1.245 1.223 1.18 1.15 0.5 5.0 7.5
1.265 1.26 1.21 1.18 V
VTH-
%
-100 0 100
+100 4
nA V s
2 0.4 0.4 500
s V V nA
VOL ILEAK
2
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Ultra-Small, Overvoltage Protection/ Detection Circuits
ELECTRICAL CHARACTERISTICS (continued)
(VCC = 14V, TA = -40C to +125C, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER EN/EN, LOGIC Input Voltage EN/EN, LOGIC Input Current EN/EN, LOGIC Pulse Width VCC to GATE_ Output Low Voltage VCC to GATE_ Clamp Voltage MAX16012 Reference Output Voltage Reference Short-Circuit Current Reference Load Regulation Input Offset Voltage Input Offset Current Input Hysteresis Common-Mode Voltage Range Common-Mode Rejection Ratio Comparator Power-Supply Rejection Ratio CMVR CMRR PSRR DC MAX16012, DC 0 70 70 VREF ISHORT No load REF = GND Sourcing, 0 IREF 1A Sinking, -1A IREF 0 VCM = 0 to 2V -12.5 3 8 2.0 1.275 1.3 100 0.1 0.1 +12.5 1.320 V A mV/A mV nA mV V dB dB IGATE_SINK = 75A, IGATE_SOURCE = 1A, VCC = 14V VCC = 24V 10 7 12 11 18 SYMBOL VIL VIH 1.4 1 2 CONDITIONS MIN TYP MAX 0.4 UNITS V A s V V
MAX16010-MAX16014
Note 1: 100% production tested at TA = +25C and TA = +125C. Specifications at TA = -40C are guaranteed by design.
Typical Operating Characteristics
(VIN = 14V, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX16010 toc01
SUPPLY CURRENT vs. TEMPERATURE
MAX16010 toc02
GATE VOLTAGE vs. SUPPLY VOLTAGE
MAX16013/MAX16014 SET = GND, EN = VCC
MAX16010 toc03
40 35 SUPPLY CURRENT (A) 30 25 20 15 10 5 15 25 35 45 55 65 MAX16012 IN+ = IN- = GND MAX16010/MAX16011 INA+ = INB- = GND OUTPUTS ENABLED MAX16013/MAX16014 SET = GND, EN = VCC
26.50 26.45 26.40 SUPPLY CURRENT (A) 26.35 26.30 26.25 26.20 26.15 26.10 26.05 26.00 MAX16013/MAX16014 SET = GND, EN = VCC
60 50 GATE VOLTAGE (V) 40 30 20 10 0 VCC - VGATE
VGATE
75
-40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C)
5
15
25
35
45
55
65
75
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
Typical Operating Characteristics (continued)
(VIN = 14V, TA = +25C, unless otherwise noted.)
UVLO THRESHOLD vs. TEMPERATURE
MAX16010 toc04
INA+/INB-/SET THRESHOLD vs. TEMPERATURE
MAX16010 toc05
GATE VOLTAGE vs. TEMPERATURE
9.9 9.8 (VCC - VGATE) (V) 9.7 9.6 9.5 9.4 9.3 9.2 9.1 9.0 MAX16013/MAX16014 SET = GND, EN = VCC
MAX16010 toc06
5.5 5.4 5.3 UVLO THRESHOLD (V) 5.2 5.1 5.0 4.9 4.8 4.7 4.6 4.5 FALLING RISING INA+/INB-/SET = GND EN = VCC
1.30 1.29 INA+/INB-/SET THRESHOLD (V) 1.28 1.27 1.26 1.25 1.24 1.23 1.22 1.21 1.20 INA+/INB-/SET RISING EN = VCC
10.0
-40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C)
-40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C)
-40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C)
STARTUP WAVEFORM (ROUT = 100, CIN = 10F, COUT = 10nF)
MAX16010 toc07
STARTUP WAVEFORM (ROUT = 100, CIN = 10F, COUT = 10nF)
MAX16010 toc08
VCC 10V/div
VCC 1V/div
VGATE 5V/div VOUT 10V/div VEN = 0 TO 2V 200s/div 20s/div
VGATE 10V/div
VOUT 10V/div
OVERVOLTAGE SWITCH FAULT (ROUT = 100, CIN = 80F, COUT = 10nF)
MAX16010 toc09
OVERVOLTAGE LIMIT (ROUT = 100, CIN = 80F, COUT = 10nF)
MAX16010 toc10
VCC 20V/div
VCC 20V/div VGATE 20V/div
VGATE 20V/div
VOUT 20V/div VIN = 12V TO 40V, TRIP THRESHOLD = 28V 1ms/div
VOUT 20V/div VIN = 12V TO 40V TRIP THRESHOLD = 28V 1ms/div
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Ultra-Small, Overvoltage Protection/ Detection Circuits
Pin Description
PIN MAX16010 MAX16011 MAX16012 MAX16013 MAX16014 NAME FUNCTION
MAX16010-MAX16014
1 2 3
1 2 --
1 2 --
1 2 --
VCC GND EN
Positive-Supply Input Voltage. Connect VCC to a 5.5V to 72V supply. Ground Active-Low Enable Input. Drive EN low to turn on the voltage detectors. Drive EN high to force the OUTA and OUTB outputs low. EN is internally pulled up to VCC. Connect EN to GND if not used. Open-Drain Monitor B Output. Connect a pullup resistor from OUTB to VCC. OUTB goes low when INB- exceeds VTH+ and goes high when INB- drops below VTH- (with LOGIC connected to GND for the MAX16011). Drive LOGIC high to reverse OUTB's logic state. OUTB is usually used as an overvoltage output. OUTB goes low (LOGIC = low) or high (LOGIC = high) when VCC drops below the UVLO threshold voltage. Adjustable Voltage Monitor Threshold Input Active-High ENABLE Input. For the MAX16010/MAX16011, drive EN high to turn on the voltage detectors. Drive EN low to force OUTA low and OUTB low (LOGIC = low) or high (LOGIC = high). For the MAX16013/MAX16014, drive EN high to enhance the p-channel MOSFET (P2), and drive EN low to turn off the MOSFET. EN is internally pulled down to GND. Connect EN to VCC if not used. Open-Drain Monitor A Output. Connect a pullup resistor from OUTA to VCC. OUTA goes low when INA+ drops below VTH- and goes high when INA+ exceeds VTH+. OUTA is usually used as an undervoltage output. OUTA also goes low when VCC drops below the UVLO threshold voltage. Adjustable Voltage Monitor Threshold Input OUTB Logic-Select Input. Connect LOGIC to GND or VCC to configure the OUTB logic. See the MAX16011 output logic table. Open-Drain Comparator Output. Connect a pullup resistor from OUT to VCC. OUT goes low when IN+ drops below IN-. OUT goes high when IN+ exceeds IN-. Inverting Comparator Input Internal 1.30V Reference Output. Connect REF to IN+ for active-low output. Connect REF to IN- for active-high output. REF can source and sink up to 1A. Leave REF floating if not used. REF output is stable with capacitive loads from 0 to 50pF. Noninverting Comparator Input
4
4
--
--
OUTB
5
5
--
--
INB-
6
6
--
5
EN
7 8 -- -- -- -- --
7 8 3 -- -- -- --
-- -- -- 3 4 5 6
-- -- -- -- -- -- --
OUTA INA+ LOGIC OUT INREF IN+
--
--
--
3
Gate-Driver Output. Connect GATE2 to the gate of an external p-channel MOSFET pass switch. GATE2 is driven low to the higher of VCC - 10V or GND during normal operations and quickly shorted GATE2 to VCC during an overvoltage condition (SET above the internal threshold). GATE2 is shorted to VCC when the supply voltage goes below the UVLO threshold voltage. GATE2 is shorted to VCC when EN is low. SET Device Overvoltage Threshold Adjustment Input. Connect SET to an external resistive divider network to adjust the desired overvoltage disable or overvoltage limit threshold (see the Typical Application Circuit and Overvoltage Limiter section). Gate-Driver Output. Connect GATE1 to the gate of an external p-channel MOSFET to provide low drop reverse voltage protection. Exposed Pad. Connect EP to GND.
--
--
--
4
-- --
-- --
-- --
6 --
GATE1 EP
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
Voltage Monitoring
+48V R1 EN INA+ R2 VCC OUTA OUTB IN DC-DC REGULATOR
EN
MAX16010
INBR3 GND EN
The MAX16010/MAX16011 include undervoltage and overvoltage comparators for window detection (see Figure 1). OUT_ asserts high when the monitored voltage is within the selected "window." OUTB asserts low when the monitored voltage falls below the lower (VTRIPLOW) limit of the window, or OUTA asserts low if the monitored voltage exceeds the upper limit (VTRIPHIGH). The application in Figure 1 shows OUT_ enabling the DC-DC converter when the monitored voltage is in the selected window. The resistor values R1, R2, and R3 can be calculated as follows: R VTRIPLOW = VTH - TOTAL R2 + R 3
Figure 1. MAX16010 Monitor Circuit
Detailed Description
The MAX16010-MAX16014 is a family of ultra-small, lowpower, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automotive, telecom, and industrial applications. These devices operate over a wide 5.5V to 72V supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. The MAX16010 and MAX16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. These comparators offer opendrain outputs capable of handling voltages up to 72V. The MAX16010 features complementary enable inputs (EN/EN), while the MAX16011 features an active-high enable input and a selectable active-high/low OUTB output. The MAX16012 offers a single comparator and an independent reference output. The reference output can be directly connected to either the inverting or noninverting input to select the comparator output logic. The MAX16013 and MAX16014 are overvoltage protection circuits that are capable of driving two p-channel MOSFETs to prevent reverse battery and overvoltage conditions. One MOSFET (P1) eliminates the need for external diodes, thus minimizing the input voltage drop. While the second MOSFET (P2) isolates the load or regulates the output voltage during an overvoltage condition. The MAX16014 keeps the MOSFET (P2) latched off until the input power is cycled.
R VTRIPHIGH = VTH + TOTAL R3 where RTOTAL = R1 + R2 + R3. Use the following steps to determine the values for R1, R2, and R3. 1) Choose a value for RTOTAL, the sum of R1, R2, and R3. Because the MAX16010/MAX16011 have very high input impedance, RTOTAL can be up to 5M. 2) Calculate R3 based on R TOTAL and the desired upper trip point: R3 = VTH + x R TOTAL VTRIPHIGH
3) Calculate R2 based on RTOTAL, R3, and the desired lower trip point: R2 = VTH - x R TOTAL - R3 VTRIPLOW
4) Calculate R1 based on RTOTAL, R3, and R2: R1 = RTOTAL - R2 - R3 The MAX16012 has both inputs of the comparator available with an integrated 1.30V reference (REF). When the voltage at IN+ is greater than the voltage at IN- then OUT goes high. When the voltage at IN- is greater than the voltage at IN+ then OUT goes low. Connect REF to IN+ or IN- to set the reference voltage value. Use an external resistive divider to set the monitored voltage threshold.
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
VBATT
P1 P2
R1 IN+ R2 REF
VCC RPULLUP
VBATT
GATE1
VCC
GATE2 R1
MAX16012
OUT
OUT
MAX16013
SET
INGND
R2
GND
Figure 2. Typical Operating Circuit for the MAX16012
Figure 3. Overvoltage Limiter Protection
The MAX16013/MAX16014 can be configured as an overvoltage switch controller to turn on/off a load (see the Typical Application Circuit). When the programmed overvoltage threshold is tripped, the internal fast comparator turns off the external p-channel MOSFET (P2), pulling GATE2 to VCC to disconnect the power source from the load. When the monitored voltage goes below the adjusted overvoltage threshold, the MAX16013 enhances GATE2, reconnecting the load to the power source (toggle ENABLE on the MAX16014 to reconnect the load). The MAX16013 can be configured as an overvoltage limiter switch by connecting the resistive divider to the load instead of VCC (Figure 3). See the Overvoltage Limiter section.
Hysteresis
Hysteresis adds noise immunity to the voltage monitors and prevents oscillation due to repeated triggering when the monitored voltage is near the threshold trip voltage. The hysteresis in a comparator creates two trip points: one for the rising input voltage (VTH+) and one for the falling input voltage (VTH-). These thresholds are shown in Figure 4.
Enable Inputs (EN or EN)
The MAX16011 offers an active-high enable input (EN), while the MAX16010 offers both an active-high enable input (EN) and active-low enable input (EN). For the MAX16010, drive EN low or EN high to force the output low. When the device is enabled (EN = high and EN = low) the state of OUTA and OUTB depends on INA+ and INB- logic states.
Supply Voltage
Connect a 5.5V to 72V supply to VCC for proper operation. For noisy environments, bypass VCC to GND with a 0.1F or greater capacitor. When VCC falls below the UVLO voltage the following states are present (Table 1).
VHYST VTH+
Table 1. UVLO State (VCC < VUVLO)
PART MAX16010 MAX16011 MAX16012 MAX16013 MAX16014 OUTA Low Low -- -- Low Low, LOGIC = low High, LOGIC = high -- -- OUTB OUT -- -- Low -- GATE2 -- -- -- High
VOUT VIN+
VTH-
VCC tPROP 0V tPROP tPROP
Figure 4. Input and Output Waveforms _______________________________________________________________________________________ 7
Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
Table 2. MAX16011 Output Logic
LOGIC Low Low High High INA+ > VTH+ < VTH> VTH+ < VTHINB> VTH+ < VTH> VTH+ < VTHOUTA High Impedance Low High Impedance Low OUTB Low High Impedance High Impedance Low
Input Transients Clamping
When the external MOSFET is turned off during an overvoltage occurrence, stray inductance in the power path may cause voltage ringing to exceed the MAX16013/MAX16014 absolute maximum input (VCC) supply rating. The following techniques are recommended to reduce the effect of transients: * Minimize stray inductance in the power path using wide traces, and minimize loop area including the power traces and the return ground path. * Add a zener diode or transient voltage suppresser (TVS) rated below VCC absolute maximum rating (Figure 3).
For the MAX16011, drive EN low to force OUTA low, OUTB low when LOGIC = low, and OUTB high when LOGIC = high. When the device is enabled (EN = high) the state of OUTA and OUTB depends on the INA+, INB-, and LOGIC input (see Table 2). For the MAX16013/MAX16014, drive EN low to pull GATE2 to VCC, turning off the p-channel MOSFET (P2). When the device is enabled (EN = high), GATE2 is pulled to the greater of (VCC - 10V) or GND turning on the external MOSFET (P2).
Overvoltage Limiter
When operating in overvoltage-limiter mode, the MAX16013 drives the external p-channel MOSFET (P2), resulting in the external MOSFET operating as a voltage regulator. During normal operation, GATE2 is pulled to the greater of (VCC - 10V) or GND. The external MOSFET's drain voltage is monitored through a resistor-divider between the P2 output and SET. When the output voltage rises above the adjusted overvoltage threshold, an internal comparator pulls GATE2 to VCC. When the monitored voltage goes below the overvoltage threshold, the p-channel MOSFET (P2) is turned on again. This process continues to keep the voltage at the output regulated to within approximately a 5% window. The output voltage is regulated during the overvoltage transients and the MOSFET (P2) continues to conduct during the overvoltage event, operating in switched-linear mode. Caution must be exercised when operating the MAX16013 in voltage-limiting mode for long durations due to the MOSFET's power dissipation consideration (see the MOSFET Selection and Operation section).
Applications Information
Load Dump
Most automotive applications are powered by a multicell, 12V lead-acid battery with a voltage between 9V and 16V (depending on load current, charging status, temperature, battery age, etc.). The battery voltage is distributed throughout the automobile and is locally regulated down to voltages required by the different system modules. Load dump occurs when the alternator is charging the battery and the battery becomes disconnected. Power in the alternator inductance flows into the distributed power system and elevates the voltage seen at each module. The voltage spikes have rise times typically greater than 5ms and decays within several hundred milliseconds but can extend out to 1s or more depending on the characteristics of the charging system. These transients are capable of destroying sensitive electronic equipment on the first fault event. The MAX16013/MAX16014 provide the ability to disconnect the load from the charging system during an overvoltage condition to protect the module. In addition, the MAX16013 can be configured in a voltage-limiting mode. This allows continuous operation while providing overvoltage protection. See the Overvoltage Limiter section.
MOSFET Selection and Operation (MAX16013 and MAX16014)
Most battery-powered applications must include reverse voltage protection. Many times this is implemented with a diode in series with the battery. The disadvantage in using a diode is the forward voltage drop of the diode, which reduces the operating voltage available to downstream circuits (V LOAD = V BATTERY - V DIODE ). The MAX16013 and MAX16014 include high-voltage GATE1 drive circuitry allowing users to replace the high-voltagedrop series diode with a low-voltage-drop MOSFET device (as shown in the Typical Operating Circuit and Figure 3). The forward voltage drop is reduced to ILOAD x RDS-ON of P1. With a suitably chosen MOSFET, the voltage drop can be reduced to millivolts.
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Ultra-Small, Overvoltage Protection/ Detection Circuits
In normal operating mode, internal GATE1 output circuitry enhances P1 to a 10V gate-to-source (VGS) for 11V < V CC < 72V. The constant 10V enhancement ensures P1 operates in a low RDS-ON mode, but the gate-source junction is not overstressed during highbattery-voltage application or transients (many MOSFET devices specify a 20V VGS absolute maximum). As VCC drops below 10V GATE1 is limited to GND, reducing P1 VGS to VCC - GND. In normal operation the P1 power dissipation is very low: P1 = ILOAD2 x RDS-ON During reverse-battery applications, GATE1 is limited to GND and the P1 gate-source junction is reverse biased. P1 is turned off and neither the MAX16013/ MAX16014 nor the load circuitry is exposed to the reverse-battery voltage. Care should be taken to place P1 (and its internal drain-to-source diode) in the correct orientation for proper reverse battery operation. P2 protects the load from input overvoltage conditions. During normal operating modes (the monitored voltage is below the adjusted overvoltage threshold), internal GATE2 output circuitry enhances P2 to a 10V gate-tosource (VGS) for 11V < VCC < 72V. The constant 10V enhancement ensures P2 operates in a low R DS-ON mode but the gate-to-source junction is not overstressed during high-battery-voltage applications (many pFET devices specify a 20V VGS absolute maximum). As VCC drops below 10V, GATE2 is limited to GND, reducing P2 VGS to VCC - GND. In normal operation, the P2 power dissipation is very low: P2 = ILOAD2 x RDS-ON During overvoltage conditions, P2 is either turned completely off (overvoltage-switch mode) or cycled off-onoff (voltage-limiter mode). Care should be taken to place P2 (and its internal drain-to-source diode) in the correct orientation for proper overvoltage protection operation. During voltage-limiter mode, the drain of P2 is limited to the adjusted overvoltage threshold, while the battery (VCC) voltage rises. During prolonged overvoltage events, P2 temperature can increase rapidly due to the high power dissipation. The power dissipated by P2 is: P2 = VDS-P2 x ILOAD = (VCC - VOV-ADJUSTED) x ILOAD where VCC ~ VBATTERY and VOV-ADJUSTED is the desired load limit voltage. For prolonged overvoltage events with high P2 power dissipation, proper heatsinking is required.
MAX16010-MAX16014
Adding External Pullup Resistors
It may be necessary to add an external resistor from V CC to GATE1 to provide enough additional pullup capability when the GATE1 input goes high. The GATE_ output can only source up to 1A current. If the source current is less than 1A, no external resistor may be necessary. However, to improve the pullup capability of the GATE_ output when it goes high, connect an external resistor between VCC and the GATE_. The application shows a 2M resistor, which is large enough not to impact the sinking capability of the GATE_ (during normal operation) while providing enough pullup during an overvoltage event. With an 11V (worst case) VCC -to-gate clamp voltage and a sinking current of 75A, the smallest resistor should be 11V/75A, or about 147k. However, since the GATE_ is typically low most of the time, a higher value should be used to reduce overall power consumption.
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
Functional Diagrams
VCC REGULATOR VCC REGULATOR
~4V
~4V
MAX16010
INA+ OUTA INA+
MAX16011
OUTA
HYST
HYST
INB-
OUTB
INB-
OUTB
HYST 1.23V ENABLE CIRCUITRY GND EN EN GND 1.23V
HYST
ENABLE CIRCUITRY EN
OUTB LOGIC
LOGIC
Figure 5. MAX16010 Functional Diagram
Figure 6. MAX16011 Functional Diagram
VCC REGULATOR
VCC
~4V
MAX16012
INOUT
SET GATE2 HYST 1.23V
IN+
REF
GATE1
1.30V
MAX16013 MAX16014
ENABLE CIRCUITRY LATCH CLEAR
GND
GND EN
Figure 7. MAX16012 Functional Diagram 10
Figure 8. MAX16013/MAX16014 Functional Diagram
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Ultra-Small, Overvoltage Protection/ Detection Circuits
Pin Configurations
TOP VIEW
INA+ 8 OUTA 7 EN 6 INB5 INA+ 8 OUTA 7 EN 6 INB5
MAX16010-MAX16014
MAX16010
MAX16011
1 VCC
2 GND
3 EN
4 OUTB
1 VCC
2
3
4
GND LOGIC OUTB
TDFN (3mm x 3mm)
TDFN (3mm x 3mm)
IN+ 6
REF 5
IN4
GATE1 6
EN 5
SET 4
MAX16012
MAX16013 MAX16014
1 VCC
2 GND
3 OUT
1 VCC
2 GND
3 GATE2
TDFN (3mm x 3mm)
TDFN (3mm x 3mm)
Chip Information
PROCESS: BiCMOS
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Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010-MAX16014
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
21-0137
H
1 2
COMMON DIMENSIONS SYMBOL A D E A1 L k A2 MIN. 0.70 2.90 2.90 0.00 0.20 MAX. 0.80 3.10 3.10 0.05 0.40
PACKAGE VARIATIONS PKG. CODE T633-1 T633-2 T833-1 T833-2 T833-3 T1033-1 T1033-2 T1433-1 T1433-2 N 6 6 8 8 8 10 10 14 14 D2 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.700.10 1.700.10 E2 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 e 0.95 BSC 0.95 BSC 0.65 BSC 0.65 BSC 0.65 BSC 0.50 BSC 0.50 BSC 0.40 BSC 0.40 BSC JEDEC SPEC MO229 / WEEA MO229 / WEEA MO229 / WEEC MO229 / WEEC MO229 / WEEC MO229 / WEED-3 MO229 / WEED-3 ------b 0.400.05 0.400.05 0.300.05 0.300.05 0.300.05 0.250.05 0.250.05 0.200.05 0.200.05 [(N/2)-1] x e 1.90 REF 1.90 REF 1.95 REF 1.95 REF 1.95 REF 2.00 REF 2.00 REF 2.40 REF 2.40 REF
0.25 MIN. 0.20 REF.
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
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Revision History
Pages changed at Rev 2: 1, 10, 12
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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